Hot Melt Adhesive a Wɔde Yɛ Ɛlektrɔnik Nneɛma

Wɔyɛɛ Hot Melt Adhesive for Electronics titiriw maa nneɛma fitaa-nneɛma, tumi-adwinnade, LED-draiver ne mfiri nketewa-mfiridwumayɛfo a wohia nhyiamu a ɛho tew ntɛmntɛm a wɔde ka ho ne nneɛma a atwa yɛn ho ahyia ho banbɔ a ɛbɛkyɛ. Ntama no pue yiye wɔ 150-170℃denam 11 mm gluu atuo anaa micro-dispensing ti so, ɛma ABS, PC, PP, aluminium ne kɔbere yɛ nsu a ɛnyɛ nsɛe anaasɛ nhwiren. Wɔ sikani 3-6 mu no, bond no dwo kɔ thermoplastic a ɛyɛ den, fitaa, ɛnyɛ kɔkɔɔ a ɛde 3.5 MPa shear ahoɔden ma wɔ ABS/ABS nkwaa so na ɛtwam 1000 h wɔ 70℃/85 % RH a enni mu duru a ɛso tew anaasɛ mpaapaemu.

A precisely tuned 110℃Ring-&-Ball softening point ma polymer no yɛ den bere a normal appliance self{3}}heating, nanso ma kwan ma low-ɔhyew application a ɛbɔ ɔhyew-sensitive nneɛma te sɛ SMD capacitors ne thin-fasu plastics. Sɛ wɔde si hɔ wie a, ade a wɔde nkata so no yɛ nsuo-siw film a ɛkɔ so a ɛma mfutuma-siw ano wɔ enclosure seams, cord entries ne potting-free PCB anoano, na ɛtwa hia a ɛhia sɛ wɔde silicone gaskets anaa mmienu{11}}afã epoxyes di dwuma. Hydrogenated tackifying resins yi unsaturated double bonds fi hɔ, na ɛma VOC a ɛba fam sen 50 μg g−1 (EU ISO 16000-6) ne hua dodow a wontumi nhu wɔ 50 mm akyirikyiri, boa ma nnwuma a wɔyɛ no ma wodu LEED, WELL ne BSCI dan mu mframa gyinapɛn ahorow ho.

Nnuru no yɛ 100 % a halogens, antimony, dade a emu yɛ duru, phthalates ne formaldehyde nni mu, ɛne RoHS 2.0, REACH SVHC 240 hyia LED solder a wɔde yɛ nneɛma nsɛntitiriw. Saa hot-melt stick yi tacks afã horow ntɛmntɛm, seals tia nsu ne mfutuma, tra ase wɔ mfiri adwumayɛ ɔhyew mu na ɛma adwuma fam yɛ ahabammono, Hot Melt Adhesive for Electronics de krado-de -de di dwuma, ɛka-akorae ano aduru a ɛtwam biara compliance audit.

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